Hi,
How can I take into account the residual stress of a piezoelectric material in a piezoelectric analysis?
PLANE13/PLANE223 do not accept INISTATE command to do so...
Best regards
Hello everybody,
For the purpose of describing macroscopic thermo-mechanical behavior of BEOL (Back End Of the Line) interconnect structure, the heterogeneous BEOL stack (Cu, porous materials...) may be approximated as a homogeneous medium with certain effective moduli and Poisson ratios. I'm...
Hi,
I would like to know how to enter the evolution of the CTE of a resin vs. the temperature because a resin has got a glass transition temperature so there are 2 CTEs...
Thankd in advance.
Dear community,
I'm trying to simulate a creep test done with the 3-point bending method (DMA test) under ANSYS to compare reality to ANSYS results. The material used is a PbSbSn or a PbSnAg soft solder following the Garofalo model (CREEP option in ANSYS with PLANE182) but the strain resulting...
Dear community,
I'm trying to simulate a creep test done with the 3-point bending method (DMA test) under ANSYS. The material used is a PbSbSn or a PbSnAg soft solder following the Garofalo model (CREEP option in ANSYS with PLANE182) but the strain resulting is disproportionate to the real...