I was referring IEC 61439-1 standard for the deriving the temperature rise of an assembly through comparison. We can derive the current rating of an assembly (low voltage switchboard) at any point (contacts such as busbar joints, SCPD joint, or any other contact) by using the formula of Copper...
I am trying to understand a temperature rise test that is being conducted over a switchboard. The test conforms to IEC 61439-1. The clause 10.10.2.3.1 (Method of test - General) regarding the temperature rise states about the constant value. It says,
"The constant value is reached, in practical...