Thanks all. A hole would resolve things, but the PCB is laid out and we're quite a way down the road now, so I'm loath to re-open that wound.
I've also learned the phrase "glob top" ;). For now I've gone with hot melt, but thanks to you all I've got a few more options to consider.
Cheers!
Hi all,
I have a stranded wire soldered to a PCB, 22swg or thereabouts. The wire is likely to see a limited amount of moving around, because it is attached to a battery cover, so everytime the product's batteries are changed (maybe once every 6 months), the wire is going to get wiggled about...
Hi chez311,
I totally did not spot AndrewTT's suggestion! Thanks for the nudge :) Yes, that does sound better, I'm sure I could arrange that. I'll have another look at the standard, but it sounds doable.
Brilliant, thanks all.
Thanks for these responses!
One reason why I'm interested in getting a GD&T scheme running for this is that the current way of testing is highly subjective, and I'm trying to move us to using an CMM for increased speed and repeatability... so I'm trying to communicate our requirements to the CMM...
Hi all,
Here's a brainteaser for you. I've got a spun metal dome, which has a fancy profile laser-cut out of it. The spherical diameter of the dome is +/- 0.5mm; the profile needs to be cut out +/- 0.2mm. I know that sounds weird (why are you worried about the position of the profile if the dome...
