Hi all,
I found that some of the parts in electronic package model delaminate after FEA thermal stress analysis (ANSYS 7.0 Workbench) as follows:
http://www2.acae.cuhk.edu.hk/~tyma00/before.JPG
http://www2.acae.cuhk.edu.hk/~tyma00/after.JPG
What can I do to solve this probelm?
Thank you very much.
Dear quark: I find it in some spec. for adhesive.
Dear kenvlach: Thanks for you help. How about the thermal conductivity? I can't convert the unit "ppm" to "W/m-K" because thermal conductivity is not a ratio.