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I am familiar with some simulators for RF and Microwave design. The easiest I've used is Microwave Office from Applied Wave Research. This software is expensive but you may be able to get a trial licence. Another good package is Ansoft designer. Either one should help with calculating parasitics...

I am DIYing a tranmission line to a pool pump. I am unable to find code specifics in the NEC 2002 at the library. I know generally what must be done but need to know code on the following: How deep to bury wire? What type of wire for underground? How to ground the pool and motor according to...

Bill As mduplessis stated, 1/((hi)A will give you conductive thermal resistance, which does depend on contact area. As for question 1, I can only confirm that pressure has a big influence on conductance, which is well known in lamination technology. The relationship of heat transfer and...

I am in desperate need of help from anyone with experience with ASTM D149. Specifically I need a recomendation on a good insulating oil with a high dielectric breakdown voltage. Thanks in advance. Seth

Does anyone have a useful link or direct experience on PIM (passive intermodulation) as it relates to antenna's? Thanks in advance. Seth Normyle Process Engineer

toolaholic I may have pointed you in the wrong direction, my apologies. Direct metalization is a process in printed circuit board fabrication. The technology may have other applications however. For an overview see: http://www.electrochemicals.com/tech1.htm#dm Seth Normyle Process Engineer

Steve I work in the high frequency circuit industry and see a lot of aviation applications. I know first hand that teflon based circuit materials perform flawless at low temperatures. I cannot speak for the performance of other types of substrates. Seth Normyle Process Engineer

My vote is for negative cooling as in passive PCB components with high thermal conductivity which draw heat our of active (heat producing) components. This type keeps the transfer within the confines of conduction.

toolaholic There is a relatively new method called direct metalization which seeds a cunductive polymer to the hole to carry the electroplating current. This replaces the classical platinum seeding method.

Anyone with experience with IPC-TM-650 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material please give advice. I am using a two pinned fixture and I'm getting questionalble data.