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Ok, the problem is I use a local heating source material to bond two components. During the bonding, the material and its attached solder will melt and bond to the components, which will cause only a thin layer of the components temperature increase. I can get the temperature profile for this...

Thank you for the reply. The problem is the temperature profile of stress 0 is not just one temperature value, it is a exponential curve alone the height direction.

I am doing a thermal-stress analysis, and I first dsolve the thermal problem and got the temperature profile, which is supposed to be the stress 0 temperature profile for the component. Then I need to get the stress distribution when it cools down to room temperature. My problem is when I set...

I tried, and it didn't work. BTW, the ANSYS I am using is ANSYS Professional, which doesn't allow nonlinear analysis, is this the reason why I can not carry the results forward? Thanks a lot!

It is a two step problem. I need to use the first step results as the second step initial conditions. Althought the geometry and meshing has not been changed, but the material has been changed for the second step. How can I do with it? Thanks a lot!

When I tried to solve a dynamic analysis (two steps load). the warning poped out "file.mode was not found". I have no idea what it means. Did I miss something? Thanks!

I got it. Thanks a lot!

I want to apply different reference temperature for the different parts of a geometry, is there any way I can do it? Thanks