hi everyone,
fristly thanks for Transient1 replies. My assumption(in %)just a example but in fact the encapsulant will capture small portion of heat from light.
As transient 1 said, 5 Watts in the Encapsulant (Total Volumetric Heating), the problem is how do i apply this by using Ansys WB...
hi everyone,
actually the condition is like this..
normally 20% of the power disspated from Die will transitted into light. however there is 5% of the light(heat)be captured in the encapsulation. this amount of heat might cause the LED become failure.
so by using ansys WB, how do i do the...
hi erveryone..
i find difficulty to do my simulation by using Ansys Workbench. The problem is i know that the epoxy encapsulant for a high power LED will capture small amount(known amount) of heat. In my simulation, i dono how to apply this condition in.
What should i do?
thanks
im sorry. Or i change my question a bit.
If we use FEA method to simulate or analyze LED, i will found that the temperature of silicone is lower than die tempperature. however in real life, the silicone temperature is much higher than die temperature as i mentioned before this.
In order to...
For high power LED, why the temperature of silicone can reach around 200 degree C although the die temperature only around 100++ degree C?
where can i find related journal regrading to the Q?
For high power LED, why the temperature of silicone can reach around 200 degree C although the die temperature only around 100++ degree C?
where can i find related journal regrading to the Q?
