Thanks guys, I found a company which provides mechanical fixtures for wafers. These fixtures keep one side dry while exposing the other to KOH. They also offer systems for electrochemical etch-stop to control the membrane thickness.
(check ammt.com)
http://www.ammt.com
Hi all,
I'm planning on a process where I want to create membranes in a KOH etch from the back side but the front-side is already structured and must remain dry. I want to control the membrane thickness (~18µ) optically. Does anyone
have experience with such a process or knowledge on the...