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I've talked with some other engineers. They haven't had much success in reducing range in the past. I'm trying to be a hero :). Due to the equipment, measuring wafer temperature profile would be difficult (if not impossible). Equipment uses a vertical "boat" of 100+ wafers in a heated tube...

Nope, it is for a process at work. Just trying to improve it.

I'm trying to increase my thickness uniformity in SiO2 deposition for a dry, high temperature oxidation process. My wafer profile is thin in the middle and thicker towards the outsides. The film is thin (~100-50 Angstroms) and the proces temperature is relatively low (~780). It appears to be...