sp8472
Mechanical
- Oct 12, 2010
- 29
On a lot of electronic assemblies, I see silicone, or even hot glue sometimes, used to secure large components against motion or vibration. I know that solder is weak structurally.
Some assemblies have silicone on darn near everything that has more than several millimeters of height. I've seen computer power supply teardown photos that look like that: Whole sections are buried in silicone. Others only put it on very large components.
-- Is there an IPC or EIA spec, or some kind of standard that says when it is necessary or advisable to use something to secure a component in addition to its solder joints?
Right now, the silicone processing step is seen as nothing more than a waste of labor. Unless I can provide some good evidence and proof of it from some external source, that step will likely be eliminated. I'm all in favor of reducing labor and making an efficient process, but not if it means creating failed parts.
Most of my experience on the mechanical side of things with regards to fatigue loading was with steel (good old endurance limit) and aluminum (tends not to show a flattening of that particular curve). I know that tin/lead solder is fairly weak in general, and I wouldn't want to entrust it with very much stress.
Some assemblies have silicone on darn near everything that has more than several millimeters of height. I've seen computer power supply teardown photos that look like that: Whole sections are buried in silicone. Others only put it on very large components.
-- Is there an IPC or EIA spec, or some kind of standard that says when it is necessary or advisable to use something to secure a component in addition to its solder joints?
Right now, the silicone processing step is seen as nothing more than a waste of labor. Unless I can provide some good evidence and proof of it from some external source, that step will likely be eliminated. I'm all in favor of reducing labor and making an efficient process, but not if it means creating failed parts.
Most of my experience on the mechanical side of things with regards to fatigue loading was with steel (good old endurance limit) and aluminum (tends not to show a flattening of that particular curve). I know that tin/lead solder is fairly weak in general, and I wouldn't want to entrust it with very much stress.