Bonding process modelling

[izyk]

Hi

I have a problem with bonding process modelling to obtain thermal stress resulting in deformation of the structure. The device contains two materials that are bonded in a specific temperature. Then the device is cooled to ambient temperature. Due to difference of thermal expansion coefficients, the stress is induced in the structure.

I'm performing static structural analysis. After defining all necessary boundary conditions I add thermal condition (300 and 20C) and set thermal strain effect. The simulation doesn't give appropriate results. It seems to be dependent on 22C.

Where is the problem? Should I perform some other analysis?

As I remember in Ansys APDL I applied TUNIF and BF,TEMP. Now I would like to transfer it to Ansys Workbench 14

Thanks in advice

 

[Kherszal9]

Hi izyk,

If you are going to work in Workbench, I would say that you have two options:
1) You can link your APDL work into a different workbench module.
2) Start again in Workbench.

You can do 98% of what you can in APDL with workbench, though sometimes specific functions require applying commands still.

Rather than just a static structural analysis which you currently are working with, I would suggest you detail your material properties to consider thermal effects and begin with a transient thermal. You can specify your temperature boundaries, time steps, conditions, and analysis time. This can then be linked into static structural, which will provide feedback for each step (as well as pre-stressed options should you wish.) Using several time steps you will not need to work with transient structural or rigid body dynamics from the sounds of your project.

There are ways in APDL to adjust the ambient temperature, but since you seem to want to shift to workbench, this should make your overall process even easier. I suggest using the "Record" function and saving the mAPDL data however in your analysis settings, so you have the code to try out in the classic method later, should you want to.

I hope that helps!

~ Kherszal