I am a designer electronic systems, and have been asked to do some concepts for a "transfer molded" package. I am not that familiar with the constraints on such a process.
Mainly can lead frames extend out vertically in the mold, or do they always have to be flat against the parting line?
Anyone have experience with this field? or recommend resources?
Mainly can lead frames extend out vertically in the mold, or do they always have to be flat against the parting line?
Anyone have experience with this field? or recommend resources?
