I need some double sided litho work done and I am fairly new to all the litho work. I need help in asking the engineers the right questions.
This work is supposed to be done on 8" wafers. How does one protect one side of the wafer when masking is done on the other side. Is taping appropriate?
Can someone think of questions i can ask besides the basic specs like thickness of resist, etch etc.
This work is supposed to be done on 8" wafers. How does one protect one side of the wafer when masking is done on the other side. Is taping appropriate?
Can someone think of questions i can ask besides the basic specs like thickness of resist, etch etc.