They are two different issues.
1)SUBSTATION GROUND GRID: This is infact is the system ground.
It is designed per IEEE GUIDE 80 to determine whether the calculated touch, step,
transferred potentials and GPR - mainly depends on the soil resistivity
and GF current - are within the safe limits during a ground fault inside the substation.
Because the return GF current is flowing through the soil back to the neutral of the remote Utlity
substaion transformer. STEP, Touch and grid resistance has to be measured before the commissioing
of the substation as a design verification. The recommended value per IEEE-142 is 5 Ohms
for a large substation.
2)PROCESS AREA GROUNDING SYSTEM: This is infact is the safety ground.
This safety ground is sized per local electrical codes such as CEC, NEC, BS7671 etc.
and consists of a set of copper electrodes (typically 3/4"x10ft) and bonding conductors
(typically 4/0AWG copper) scattered in the process area and all connected in paraell
thereby equivalent electrode resistance to remote earth is very low. All exposed conductive
parts such as motor frames, metallic frames of JBs etc and all extraneous conducting parts such as
building steel, pipe racks, pipes, support columns etc are all have to be bonded to this grounding system.
3) Finally, these two grounding (system + safety) systems have to be bonded together to mitigate potential
diffrence between them during a GF. But, it should be remembered that due to this bonding the
GPR of the main substation grid will be transferred as a transferred potential to the safety ground
and should be within safe limits.