Hello engineers. I really need your advice on my research.
I am trying to investigate the possibility of application of liquid based (gel or grease) non curing thermal interface material (TIM) for thermal management of electronics such as pcb, ap, etc.
The material would probably have a low viscosity like ketchup or a bit thicker and the loss modulus greater than storage modulus.
As you know, pcbs warp so I want to know which thermal and mechanical properties to look for to ensure good thermal conductivity, wettability and minimise thermal contact resistance due to bending.
What kind of testing, simulation techniques are available for such topic and what kind of properties should I be looking at?
Pls help and thanks in advance.
I am trying to investigate the possibility of application of liquid based (gel or grease) non curing thermal interface material (TIM) for thermal management of electronics such as pcb, ap, etc.
The material would probably have a low viscosity like ketchup or a bit thicker and the loss modulus greater than storage modulus.
As you know, pcbs warp so I want to know which thermal and mechanical properties to look for to ensure good thermal conductivity, wettability and minimise thermal contact resistance due to bending.
What kind of testing, simulation techniques are available for such topic and what kind of properties should I be looking at?
Pls help and thanks in advance.
