Transient1
Mechanical
- Jan 31, 2007
- 267
I have a situation where the bottom of an electrical component must be covered in one compound (k~1.25 W/m-K) in order to encapsulate the tin on its base. This is for a space application. The component's thermal path through the leads is poor and it requires a direct bond to the PCB. The same material that is used to protect the bottom of the component cannot be used due to difficulties appling it to the board (its very low viscosity).
So we use our standard component to PCB thermal compound (~.63 W/m-K). There is not a chemical reaction between the two different compounds (they've come in contact before). I assume the interface coverage is very good (no voiding). So the thermal resistance is just the path through two materials of different thermal conductivity. Is there anything I might be missing with this application? (By the way the combined bond line thickness is between .030 and .040 mils).
So we use our standard component to PCB thermal compound (~.63 W/m-K). There is not a chemical reaction between the two different compounds (they've come in contact before). I assume the interface coverage is very good (no voiding). So the thermal resistance is just the path through two materials of different thermal conductivity. Is there anything I might be missing with this application? (By the way the combined bond line thickness is between .030 and .040 mils).