Thanks, Tony.
Actually, if you read my response to IRStuff, I don't advocate solving more than a dozen or so components using CTM models on even the busiest of CCAs, be they two-resistor or nine-resistor CTMs. Also, I am always one to "limp along"
all the time because I am just a regular electronics packaging engineer who only puts on the thermal engineer's hat now and then to break the tedium
![[bigsmile] [bigsmile] [bigsmile]](/data/assets/smilies/bigsmile.gif)
. In fact, I would love to be doing even electronic packaging now because I've been out of work since August.
But, as I always do when I've been between jobs, I dig into things to increase my knowledge. This times its thermal stuff (last time it was shock and vibration stuff). I always wanted to specialize in thermal, but although I did five graduate courses in an MSME
ThermoFluids program, I never managed to get that opportunity.
I had some LinkedIn messaging with Clemens Lasance recently and he piqued my interest in the DELPHI CTM. As for thermal analysis tools on my personal computer, I don't have any. But I know how to do network resistance modeling and CFD for electronics and normally don't waste my time trying to get an FEA to do the job.
I am calling JEDEC on the 2nd to ask if they have a list of suppliers who participate and collaborate with JEDEC and provide customers with the DELPHI CTM. If I find anything I'll be sure to "share the wealth".
BTW have you heard of the Mentor Graphics
T3Ster test station for component thermal characterization (for use with
FlowTherm and
FloEFD)? If so, what do you think of that system?
H. Bruce Jackson
ElectroMechanical Product Development
UMD 1984
UCF 1993