krisys
Electrical
- May 12, 2007
- 458
We need to install single core (i.e; single conductor) 11kV cable with a circuit length of about one kM.
No. of cables per phase is six (6). The cables are aluminum wire armored. Since the facility is existing, the space available in the existing underground cable corridor (the corridor is the right of way assigned for the installation of direct buried cables) is limited.
The consultant has specified to install the cables in single layer, flat formation. This is good to improve the cable continuous current rating, as the heat dissipation is better than the trefoil formation. But by laying in the trefoil formation can accommodate the cable with in the allocated space for the cable.
Trefoil formation has the following advantages over flat formation.
- Reduces the overall cable reactance due to the reduced mutual reactance.
- Sheath voltage rise is less compared to laid in flat formation. Hence reduced circulating current (sheath current).
- For the relatively longer circuit length, the advantages gained with better heat dissipation in the flat formation, is offset due to sheath current. This is true if the Sheath Voltage Limiter (SVL) is not used.
So the method of laying is a trade off between the available space, continuous current rating, reactance etc.
Can anyone in the forum throw some light on this issue.
No. of cables per phase is six (6). The cables are aluminum wire armored. Since the facility is existing, the space available in the existing underground cable corridor (the corridor is the right of way assigned for the installation of direct buried cables) is limited.
The consultant has specified to install the cables in single layer, flat formation. This is good to improve the cable continuous current rating, as the heat dissipation is better than the trefoil formation. But by laying in the trefoil formation can accommodate the cable with in the allocated space for the cable.
Trefoil formation has the following advantages over flat formation.
- Reduces the overall cable reactance due to the reduced mutual reactance.
- Sheath voltage rise is less compared to laid in flat formation. Hence reduced circulating current (sheath current).
- For the relatively longer circuit length, the advantages gained with better heat dissipation in the flat formation, is offset due to sheath current. This is true if the Sheath Voltage Limiter (SVL) is not used.
So the method of laying is a trade off between the available space, continuous current rating, reactance etc.
Can anyone in the forum throw some light on this issue.