Wunderbear
Mechanical
Hello,
I am relatively new to ansys and I am trying to simulate an electrostatic comb drive for a micromirror. The two sets of comb drives are staggered with respect to each other in the vertical direction and there is a dummy wafer (which is 'hanging') under the top comb bank.
I am using coupled field elements to simulate the air gap (SOLID226).How should I model this dummy wafer so that I can accurately capture its effect on the electrostatic force? Also, what voltage boundary conditions should I apply on it?
Also, for this problem, which approach will give better accuracy: The multifield 'load-transfer' method or the coupled field elements method?
I am relatively new to ansys and I am trying to simulate an electrostatic comb drive for a micromirror. The two sets of comb drives are staggered with respect to each other in the vertical direction and there is a dummy wafer (which is 'hanging') under the top comb bank.
I am using coupled field elements to simulate the air gap (SOLID226).How should I model this dummy wafer so that I can accurately capture its effect on the electrostatic force? Also, what voltage boundary conditions should I apply on it?
Also, for this problem, which approach will give better accuracy: The multifield 'load-transfer' method or the coupled field elements method?