milspectrainer
Petroleum
- Nov 4, 2008
- 1
We recently started soldering with gold (80/20) and are having a huge problem. When the leads are heated and reflowed for whatever reason, the gold solder is eating the leads. If an IC has to be dipped into the pot a third time to remove any solder that has bridged accross the leads during the tinning process, the size of the lead is reduced so greatly that it becomes unusable. Can someone help me or atleast point me in the right direction?
-Josh
Mil Spec Works LLC
-Josh
Mil Spec Works LLC