DesignerGuy16
Mechanical
- Jun 18, 2008
- 303
I've got a 3/8 diameter 304 SS rod with holes drilled to accept some cold drawn 17-7 spring wire.
We were welding the end of the spring wire to the rod, but the strength wasn't there. We specified some Harris Stay-Brite 8 silver solder and Stay-Clean liquid soldering flux.
Problem is the solder isn't even adhering to the 304 SS rod, yet alone flowing between the hole and wire.
My guys are using a propane torch with some temp crayons to get the temperature right. I've watched them and can say they aren't grossly overheating the rod.
The technical guys I've talked to are at a loss. The temperature is right (solder flows at 535 deg F, and we're heating to around 550-600). The clearance is ~.003-.005, which should be perfect according to Lincoln Electric.
My next course of action is trying some Eutectic 1800 for a higher silver content, but I'm uncomfortable with having to heat to 1200 deg F as I already have some warping in the rod.
Any thoughts? Is it just an issue with the difference in base materials maybe? Is there something we're missing in the prep maybe?
James Spisich
Design Engineer, CSWP
We were welding the end of the spring wire to the rod, but the strength wasn't there. We specified some Harris Stay-Brite 8 silver solder and Stay-Clean liquid soldering flux.
Problem is the solder isn't even adhering to the 304 SS rod, yet alone flowing between the hole and wire.
My guys are using a propane torch with some temp crayons to get the temperature right. I've watched them and can say they aren't grossly overheating the rod.
The technical guys I've talked to are at a loss. The temperature is right (solder flows at 535 deg F, and we're heating to around 550-600). The clearance is ~.003-.005, which should be perfect according to Lincoln Electric.
My next course of action is trying some Eutectic 1800 for a higher silver content, but I'm uncomfortable with having to heat to 1200 deg F as I already have some warping in the rod.
Any thoughts? Is it just an issue with the difference in base materials maybe? Is there something we're missing in the prep maybe?
James Spisich
Design Engineer, CSWP