zappedagain
Electrical
- Jul 19, 2005
- 1,074
Would you expect different performance between this:
MATERIAL: ROGERS R4003, 0.008" THK, HIGH TEMP. FR4, 0.100" THK
PLATING: BOTH SIDES 99.9% Au, 0.5um THICK OVER Ni
and this:
MATERIAL: ROGERS R4003, 0.008" THK, HIGH TEMP. FR4, 0.100" THK
PLATING: BOTH SIDES IMMERSION GOLD
The R4003 copper is 1 oz (35 um) thick. We are trying to explain a steeper than expected frequency response (about 8 dB loss at 25 GHz when 2 dB is expected). The first version listed was designed but never built; the second version was introduced as a cost saving measure and manufactured; we typically only use the first version when we need to wire bond to the finished surface.
Thanks,
John D
MATERIAL: ROGERS R4003, 0.008" THK, HIGH TEMP. FR4, 0.100" THK
PLATING: BOTH SIDES 99.9% Au, 0.5um THICK OVER Ni
and this:
MATERIAL: ROGERS R4003, 0.008" THK, HIGH TEMP. FR4, 0.100" THK
PLATING: BOTH SIDES IMMERSION GOLD
The R4003 copper is 1 oz (35 um) thick. We are trying to explain a steeper than expected frequency response (about 8 dB loss at 25 GHz when 2 dB is expected). The first version listed was designed but never built; the second version was introduced as a cost saving measure and manufactured; we typically only use the first version when we need to wire bond to the finished surface.
Thanks,
John D