richard98
Electrical
- Jan 8, 2004
- 7
Hi everyone,
I am doing a thermalmechanical analysis by ANSYS 7.0 for a package with temperature decreased from 260C to room temperature. But I do not know clearly how to define the material properties of epoxy, including elastic modulus and coefficient of thermal expansion (CTE). Because modulus and CTE changed with different temperature. For modulus, I know that E1(low temperature steady state ) = 1GPa, while E2 = 0.008 GPa (high temperature steady state). In ANSYS, shall I input an averaged value of modulus? How to calculate this averaged value? Is it the area under the curve of modulus vs temperature divided by the temperature range (260-25)?
Thanks in advance!
Best regards,
Richard
I am doing a thermalmechanical analysis by ANSYS 7.0 for a package with temperature decreased from 260C to room temperature. But I do not know clearly how to define the material properties of epoxy, including elastic modulus and coefficient of thermal expansion (CTE). Because modulus and CTE changed with different temperature. For modulus, I know that E1(low temperature steady state ) = 1GPa, while E2 = 0.008 GPa (high temperature steady state). In ANSYS, shall I input an averaged value of modulus? How to calculate this averaged value? Is it the area under the curve of modulus vs temperature divided by the temperature range (260-25)?
Thanks in advance!
Best regards,
Richard