patelharshal
Mechanical
- Nov 12, 2009
- 4
Hello All
I have a problem at hand, where I am trying to simulate flip chip package under thermal loading. The goal is to calculate the fatigue life of the solder joints exposed to thermal loading ranging from -25 deg C to 125 deg C. I have all the material for the substrate, solder balls, silicon chip and the under fill.
From general research over the internet I have so far figured out that I have to define the amplitude and then define temperature field with associated amplitude in "predified fields" of Abaqus.
Now the part I am confused is what kind of step I am suppose to use, if direct cylic then what is my total time step ? and after the simulation is run does it give absoulte number of cycles to fatigue failure? or do I need to do some other calculations at the end to acquire the number of cycles to failure?
Please guide me through this. Thanks in advance for taking the time to read this.
I have a problem at hand, where I am trying to simulate flip chip package under thermal loading. The goal is to calculate the fatigue life of the solder joints exposed to thermal loading ranging from -25 deg C to 125 deg C. I have all the material for the substrate, solder balls, silicon chip and the under fill.
From general research over the internet I have so far figured out that I have to define the amplitude and then define temperature field with associated amplitude in "predified fields" of Abaqus.
Now the part I am confused is what kind of step I am suppose to use, if direct cylic then what is my total time step ? and after the simulation is run does it give absoulte number of cycles to fatigue failure? or do I need to do some other calculations at the end to acquire the number of cycles to failure?
Please guide me through this. Thanks in advance for taking the time to read this.