Thermal properties of FR-4 (fiber glass reinforced glass epoxy) 2

[main9]

Layered FR-4 is used in the manufacture of circuit cards (Printed wiring Boards). Interested in the composite thermal properties (thermal conductivity, specific heat, coefficient of thermal expansion,etc) of the multilayer (8, 10 or 12)boards. The typical thicnesses of the boards are 0.062 or 0.093 inches. Looking for literature,references, equations/formulas, etc., that can be quickly/conveniently applied to get reasonable values.

 

[13]

Check out <A HREF="

http://www.matweb.com"

TARGET="_new">

http://www.matweb.com</A>

for the properties you are<br>
looking for.<br>

 

[Norman]

There is a lot of useful materials data at<br>
&lt;<A HREF="

http://www.engineers4engineers.co.uk&gt"

TARGET="_new">

http://www.engineers4engineers.co.uk&gt</A>;<br>

<br>
Regards Norman

 

[tkelly]

You might find some data at <A HREF="

http://www.tak2000.com"

TARGET="_new">

http://www.tak2000.com</A><br>Look

under thermal data heading

 

[micass]

This site may be of interest...<A HREF="

http://www.micam.com"

TARGET="_new">

http://www.micam.com</A>,

lots of data regarding the properties you spoke of