jt783
Mechanical
- Apr 8, 2018
- 4
I am currently researching heatsinks for IC cooling. I understand that a vapor chamber will help spread the heat out through the base of the device. But when considering the R-value of the system, doesnt adding a vapor chamber only increase the R-value of the system? I would understand removing some of the base to replace with the vapor chamber, but many resources only add them as an addition.
If a vapor chamber is added to the bottom, wont the TIM material's R-value also increase the R of the system.
Will any heatsink perform be better if a vapor chamber is placed on the bottom?
If a vapor chamber is added to the bottom, wont the TIM material's R-value also increase the R of the system.
Will any heatsink perform be better if a vapor chamber is placed on the bottom?