DennisPush
Electrical
- Oct 2, 2007
- 1
Hi everyone,
(First post here, and please, forgive my English!)
I think on planning some additional tests for vacuum CB's at capacitor switching. (All the VI's are installed in SF6 invironment (1.3bar).) Analysing the data from the event registers I found that some of the CB's have restrikes often (say, every 10 switching-off or more), some don't. Some would perform even a multiple restrike phenomena.
So, I have three questions:
1. Can I assume that the performance (restrike-free) of a vacuum CB depends on vacuum integrity?
2. Is the change from integrity to a broken vacuum quick/stepwise or it may take some significant period of time? How long time? Days? Months? Years?
3. How can the vacuum integrity be tested?
To my knowledge there is a HV test (70-80% of a rated power frequency withstand voltage of a CB). This test helps in case when a VI is in an air environment but is useless (is it?) when the VI is in SF6. This is because SF6 has some 2.5 times higher break-down voltage than air and a VI filled with SF6 will certainly withstand the rated power frequency withstand voltage. Also, there is a possibility to measure the X-rays produced when HV applied across the contacts of a VI. In case of vacuum integrity there will be X-rays and in case of a VI filled with SF6 there will be no X-rays. But how can the results be interpreted if the VI just started being filling with SF6 (again, if this is not a stepwise process)? And finally there is a possibility to analyse the contact movement speed as it is believed that the contacts in VI would be slowed down by gas. But it will be nearly impossible to pick up the vacuum breaking stage and it will be hard to interpret. Does anybody have experience with these tests and how satisfactory were they found?
I would appreciate any advise!!
(First post here, and please, forgive my English!)
I think on planning some additional tests for vacuum CB's at capacitor switching. (All the VI's are installed in SF6 invironment (1.3bar).) Analysing the data from the event registers I found that some of the CB's have restrikes often (say, every 10 switching-off or more), some don't. Some would perform even a multiple restrike phenomena.
So, I have three questions:
1. Can I assume that the performance (restrike-free) of a vacuum CB depends on vacuum integrity?
2. Is the change from integrity to a broken vacuum quick/stepwise or it may take some significant period of time? How long time? Days? Months? Years?
3. How can the vacuum integrity be tested?
To my knowledge there is a HV test (70-80% of a rated power frequency withstand voltage of a CB). This test helps in case when a VI is in an air environment but is useless (is it?) when the VI is in SF6. This is because SF6 has some 2.5 times higher break-down voltage than air and a VI filled with SF6 will certainly withstand the rated power frequency withstand voltage. Also, there is a possibility to measure the X-rays produced when HV applied across the contacts of a VI. In case of vacuum integrity there will be X-rays and in case of a VI filled with SF6 there will be no X-rays. But how can the results be interpreted if the VI just started being filling with SF6 (again, if this is not a stepwise process)? And finally there is a possibility to analyse the contact movement speed as it is believed that the contacts in VI would be slowed down by gas. But it will be nearly impossible to pick up the vacuum breaking stage and it will be hard to interpret. Does anybody have experience with these tests and how satisfactory were they found?
I would appreciate any advise!!