void criteria for solder metallization?

[kelroy]

I am looking high and low through IPC, ANSI, and every spec organization I can use to find a good reference for metallization quality standards. My eyes are going buggy. Specifically, I am interested in specifying the plating void criteria (prior to solder) for metallized areas that will have components and/or a component soldered to them.

Anyone out there have any leads (no pun intended)?

Don't bother with the standard ANSI/IPC J-STD, already been there 100 times.