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I will suggest to look into nano-adhesives such as micro-emulsions.

I do not know if I well understand you: I built a steel box where I set the PCB with connecting windows. Next, I select my epoxy resin based on requirements to encapsulate the PCB. Previously, PCB circuit is protected with other adhesives to consolidate and seal the PCB.

If not found data in MSDS, then perform a DSC temperature decomposition test. Take a polymerized sample to measure the temperature.

Idea: Put paint in the middle of two equal substrates of 1" square with the required thickness. Next, set up the sample into the testing machine and raise temperature to 400 C. Test must be performed at an angle of 180.

What conductivity requirement are you looking for? Temperature? Environment?

First of all you should to know the design requirements and then check them out with ASTM stds.

Flatness should be a customer or process requirement and the plating can be evaluated with a no or destructive technique analysis.

Passivation should be not severe and the coating metal should be Zn.

You can add a layer of PU.