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When modeling chip-submount assemblies for thermal analyses, the difficulty is often modeling the entire assembly due to significant dimension differences (small chip on large submount). I remember reviewing procedures that involve decoupling the model and solving the components separately per...

I'm a bit confused; do you need to open .iges files (maybe sent to you by some else)in ACAD14, or are you looking to have access to view variuos ACAD files (.dwg) without having to open them in ACAD14 (a viewer)? Chris

I implemented a frequency analysis for a specific structure to determine the natural frequencies. My general understanding of modal analysis is that in most cases, a first or second mode near an operating frequency may cause vibration amplification. For other designs, I have verified that the...

I want to pose this question on a non-bias forum: What is the better choice for a ME Designer, SolidWorks or Inventor?

I am developing a few simple thermal models to evaluate some specific steady-state characteristics; I am using a linear FEA program.<br> <br> When setting the boundary conditions, I would like to include the free convection coefficients at appropriate edges. If I do not include convention, the...