Ansys thermocouple model

[nekojita]

I have created a thermal model of a thermocouple soldered to a stainless steel electrode. With a transient analysis, the temperature gradient is observed as a function of time. The law of intermediate metals states that the thermocouple voltage is unaffected so long as the intervening metal and the thermocouple wire connections remain isothermal. While the temperature gradient can be observed, this still does not provide information as to what the thermocouple output voltage is due to this gradient.

Is it possible to model the thermocouple voltage as part of my thermal model?

Any thoughts, comments welcome.

Thanks,

Art

 

[Drej]

Hi Art,

Yes, I think there should be no problem with modelling thermocouple voltage as well. You'll need to bear in mind that this is a multi-physics or coupled-field type analysis. Lots of interesting information in the help file, but specifically look at:

Coupled-Field Analysis Guide> Chapter 7. Direct Coupled-Field Analysis> Thermal-Electric Analysis

You'll also need a Professional or a Multi-Physics licence to do the job.

Cheers,

-- drej --


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[nekojita]

Hi Drej,

Thanks for your reply. I had read that chapter that you cited, however, was still not clear on how to proceed.

From chapter 7: "This analysis determines the temperature distribution in a conductor due to Joule heating effects from the flow of direct electric current (DC)."

The Seebeck effect occurs because of electron migration (causing the Seebeck current to flow) due to the difference in electron mobility between metals which is temperature dependent.

I don't quite see that the thermal electric model is a fit for my problem.

Thoughts?

Art

 

[harry123456]

Hi Art,
You are right. I think for your case the thermal elctric joule heating model wont fit your case. One of my colleagues has worked on this quite a bit as part of a masters thesis wherein he developed a code to study all these thermocouple effects. I am not sure if it will help you or not but you could try and look it up.
"Steady state and transient analysis of thermoelectric devices using finite element method", Gurjinder Singh, 2003. Rochester Institute of Technology.
Harry