I'm an electronics packaging engineer trying to perform a circuit-card (CCA) level thermal analysis. I’m currently using ANSYS Multiphysics. But in the past, I’ve worked with Pro/Mechanica and SolidWorks Simulation. Meshing is always an issue due to the thin copper layers, vias, etc. Lots of approximations and assumptions need to be made. Is there anyone who has experience with these types of analyses that can provide some insight or suggestions?
One idea I’m toying with is leveraging CalculiX or Elmer to try and develop a customized solution. Is something like this even feasible?
TIA
One idea I’m toying with is leveraging CalculiX or Elmer to try and develop a customized solution. Is something like this even feasible?
TIA