The following is from 250.30(A)(2) in the 2011 code.
"(2) Supply-Side Bonding Jumper. If the source of a separately derived system and the first disconnecting means are located in separate enclosures, a supply-side bonding jumper shall be installed with the circuit conductors from the source enclosure to the first disconnecting means. A supply-side bonding jumper shall not be required to be larger than the derived ungrounded conductors. The supply side bonding jumper shall be permitted to be of nonflexible metal raceway type or of the wire or bus type as follows:
(a) A supply-side bonding jumper of the wire type shall comply with 250.102(C), based on the size of the derived ungrounded conductors.
(b) A supply-side bonding jumper of the bus type shall have a cross-sectional area not smaller than a supply-side bonding jumper of the wire type as determined in 250.102(C)."
"250.102(C) Size — Supply-Side Bonding Jumper.
(1) Size for Supply Conductors in a Single Raceway or Cable. The supply-side bonding jumper shall not be smaller than the sizes shown in Table 250.66 for grounding electrode conductors. Where the ungrounded supply conductors are larger than 1100 kcmil copper or 1750 kcmil aluminum, the supply-side bonding jumper shall have an area not less than 121⁄2 percent of the area of the largest set of ungrounded supply conductors.
(2) Size for Parallel Conductor Installations. Where the ungrounded supply conductors are paralleled in two or more raceways or cables, and an individual supply-side bonding jumper is used for bonding these raceways or cables, the size of the supply-side bonding jumper for each raceway or cable shall be selected from Table 250.66 based on the size of the ungrounded supply conductors in each raceway or cable. A single supply-side bonding jumper installed for bonding two or more raceways or cables shall be sized in accordance with 250.102(C)(1)."
I believe these new sections address the question.