test123123
Student
Hello. I am doing a Femap practice. I want to attach bond pads between two square metal plates.
However, before that, I want to conduct a free-free analysis without the pads for model-Checking-Procedures.
However, the gap between the metal plates is 0.2mm, so the sol103 for free-free condition does not proceed.
The gap seems quite large, and it appears too big to use glue or contact.
In this case, can I use CBUSH to connect them? or what can I try to sol103 with free-free condition?
However, before that, I want to conduct a free-free analysis without the pads for model-Checking-Procedures.
However, the gap between the metal plates is 0.2mm, so the sol103 for free-free condition does not proceed.
The gap seems quite large, and it appears too big to use glue or contact.
In this case, can I use CBUSH to connect them? or what can I try to sol103 with free-free condition?
