hussain1437
Electrical
- Dec 7, 2010
- 2
Hello,
I am simulating a High power LED in Ansys 12, The LED has a GaN material, a Thermal Pad and casing. This LED is mounted onto a Base material.
For finding out the temparatures of the GaN chip and effects of thermal pad, i need to apply a boundary condition (convection) on thermal pad. The upper side of Thermal pad is enclosed and bottom side is mounted onto Base material using Solder pad.
For convection, the film coefficient h is to be given as input,can anyone suggest how to find out this 'h' value (method or procedure)?
The Thermal pad is a horizontal circular disk of thickness 0.2mm and diameter of 4mm.
Thank you!
I am simulating a High power LED in Ansys 12, The LED has a GaN material, a Thermal Pad and casing. This LED is mounted onto a Base material.
For finding out the temparatures of the GaN chip and effects of thermal pad, i need to apply a boundary condition (convection) on thermal pad. The upper side of Thermal pad is enclosed and bottom side is mounted onto Base material using Solder pad.
For convection, the film coefficient h is to be given as input,can anyone suggest how to find out this 'h' value (method or procedure)?
The Thermal pad is a horizontal circular disk of thickness 0.2mm and diameter of 4mm.
Thank you!