dgowans
Mechanical
- Oct 12, 2004
- 680
Our products generally consist of a PCB assembly that gets sealed in a plastic enclosure (roughly 8"x4"x1.5") via a hot-plate welding operation. Our current method of verifying that the welding operation produced a fully sealed unit is to heat the sealed product for a period of time sufficient to build internal pressure that causes the product to expand - the 1.5" dimension increases. This is a time consuming process that we're trying to revise or eliminate. Additionally, our new products are continually getting smaller so even if we wanted to stick with the same test method the amount of "puff" seen in the new enclosures is pretty minimal, making evaluation difficult.
We have proven that we can perform the same test by evaluating the units in a vacuum bell, but the equipment is quite expensive and there is resistance to going this route.
Does anyone have any other suggestions as to how we can perform this testing? Obviously fast and inexpensive are preferable, but at least we don't need a solution immediately.
Thanks in advance.
We have proven that we can perform the same test by evaluating the units in a vacuum bell, but the equipment is quite expensive and there is resistance to going this route.
Does anyone have any other suggestions as to how we can perform this testing? Obviously fast and inexpensive are preferable, but at least we don't need a solution immediately.
Thanks in advance.