acoustoelectronics
Materials
- Jul 8, 2014
- 4
Hallo everybody,
I have a problem, which has been discussed here before from some colleagues, but i can not find the thread. I am trying to deposit thin epoxy resin layers by the means of a spin coater (thickness of the layer 2-8 microns. The degassing of a low viscosity epoxy resin (500 mPas) under vacuum (1x10-3 bar) creates some problems, because even after 20 minutes there are still some air bubbles appear in the resin's volume (the resin's pot life is 30 minutes, so i can not afford to degas more than 20, because after that the resin will change its viscosity and this will cause an additional drawbacks during spin coating.)
Here I've read that one possibility is to reduce the resin's surface tension either by increasing the temperature or by additives such as BYK 051-054.
My question is what would happen with the resin's precuring time if i add BYK 051-054? Does this change the curing process and will this influence the overall stability of the full cured thin epoxy resin layer (will the resin be rigid or it will be viscoelastic after full cure)? And lastly what would happen if i add a different additive (acetone or heptane)? Thank you very much in advance.
K.E.
I have a problem, which has been discussed here before from some colleagues, but i can not find the thread. I am trying to deposit thin epoxy resin layers by the means of a spin coater (thickness of the layer 2-8 microns. The degassing of a low viscosity epoxy resin (500 mPas) under vacuum (1x10-3 bar) creates some problems, because even after 20 minutes there are still some air bubbles appear in the resin's volume (the resin's pot life is 30 minutes, so i can not afford to degas more than 20, because after that the resin will change its viscosity and this will cause an additional drawbacks during spin coating.)
Here I've read that one possibility is to reduce the resin's surface tension either by increasing the temperature or by additives such as BYK 051-054.
My question is what would happen with the resin's precuring time if i add BYK 051-054? Does this change the curing process and will this influence the overall stability of the full cured thin epoxy resin layer (will the resin be rigid or it will be viscoelastic after full cure)? And lastly what would happen if i add a different additive (acetone or heptane)? Thank you very much in advance.
K.E.