Minimize bubbles and voids in encapsulation process 1

[BOPdesigner]

Anybody aware of a published reference guide or somthing similar that explains good industrial practices used to minimize voids and bubbles during the encapsulation of electronics?

 

[itsmoked]

It's usually just your specific procedures. Don't do things that entrain air.

If you can't tolerate any bubbles then often you put the mixture into a vacuum briefly before using it. This draws the gas out of your mix.

Keith Cress
kcress -

http://www.flaminsystems.com

 

[MarkUMSU]

Dow Corning is a starting place...

http://www.dowcorning.com/content/e...rial9.asp?DCWS=Electronics&DCWSS=Encapsulants

 

[Tunalover]

I worked at a place where potting compounds were widely used. To get air bubbles out of liquid potting compounds the compounds (and often the potted assemblies) were placed in a vacuum. I don't recall how powerful the vacuum was but I'm sure that any potting compound mfgr can provide good advice along those lines.


Tunalover

 

[Maxham1]

I would suggest considering an antifoaming agent be used to reduce the amount of air bubbles. You can find more information at

http://www.emersoncumming.com.

Take a look at their technical tips section,

http://www.emersoncuming.com/generic.asp?cat_id=4&sub_cat_id=6&region_id=1

 

[Timelord]

Two words: vacuum degas

Timelord