modal analysis with damping

[proEdj]

I am doing an modal analysis on a circuit board that sits on a gap pad. This gap pad is designed to dampen vibration and also produce sufficient conduction to cool the board. It seems that applying a sping to the board is a logical way to represent this, yet I do not see a suface to surface option for setting up a spring. Can I use the Spring to point option then use a offset point as my point with the surface being the underside of the card? I can specify a different spring constant for each direction. Because I the gap pad will only really respond in one direction I will just specify that spring constant component. Does this sound like a correct approach?

Thanks,

Dane