Coctyle
Materials
- Oct 9, 2015
- 17
I have been using saturated aqueous picric acid with sodium dodecylbenzene sulfonate as the wetting agent to reveal prior austenite grain boundaries in heat treated steel. I have found that the addition of copper chloride is helpful (as described in Vander Voort's Metallography Principles and Practice, with the substitution of the dodecyl salt for the tridecyl salt that is no longer easily available).
MY question for anyone familiar with this etchant, should I be using copper(II) chloride dihydrate or anhydrous copper(II) chloride? Does it make any difference? I have been using the dihydrate, but I am going to order some fresh supplies and want to get the best stuff for the application.
MY question for anyone familiar with this etchant, should I be using copper(II) chloride dihydrate or anhydrous copper(II) chloride? Does it make any difference? I have been using the dihydrate, but I am going to order some fresh supplies and want to get the best stuff for the application.