lukeseed
Mechanical
- Oct 25, 2004
- 4
Hi there,
I have a design problem with sealing out moisture during autoclaving.
We currently are using a ferrite core wrapped in magnet wire with a cap in series to make a rf excitable lcr circuit. When exposed to rf energy this circuit rings at a certain frequency and q factor.
The problem we are having is that it is a medical device and we need to sterilize it. The chosen (and only) option for this sterilization is autoclaving which is a steam bath at 250deg F at 21psi for 20min. This process causes water vapor to invade the lcr circuit and changes the dielectric constant of the air coil/ferrite thus dropping the q and shifting the frequency.
To combat this shift we are attempting to seal the circuit in plastic. As you can imagine, the autoclave process is very hot and very likely to damage the plastic and invade the enclosure. Two things we have tried are insert molding the circuit in plastic and molding a bottom case and overmolding a cap over the case and the tag. Neither of these has worked. The insert molding pushes the tag to the side and breaks through the capsule (we are attempting to combat this by using self retracting pins to hold the circuit in place during molding) and the overmolded cap still leaks.
The plastics we have tried are PP, PE, HIPS, ABS, PC, Nylon 12, PEEK, Ryton and LCP. Of these, only PEEK, Ryton and LCP held up to the autoclave environment and all have let in moisture and an associated, unacceptable shift.
Does anyone have any ideas on this? Has anyone else been able to seal out an autoclave process and how was that done?
Thanks,
Luke
I have a design problem with sealing out moisture during autoclaving.
We currently are using a ferrite core wrapped in magnet wire with a cap in series to make a rf excitable lcr circuit. When exposed to rf energy this circuit rings at a certain frequency and q factor.
The problem we are having is that it is a medical device and we need to sterilize it. The chosen (and only) option for this sterilization is autoclaving which is a steam bath at 250deg F at 21psi for 20min. This process causes water vapor to invade the lcr circuit and changes the dielectric constant of the air coil/ferrite thus dropping the q and shifting the frequency.
To combat this shift we are attempting to seal the circuit in plastic. As you can imagine, the autoclave process is very hot and very likely to damage the plastic and invade the enclosure. Two things we have tried are insert molding the circuit in plastic and molding a bottom case and overmolding a cap over the case and the tag. Neither of these has worked. The insert molding pushes the tag to the side and breaks through the capsule (we are attempting to combat this by using self retracting pins to hold the circuit in place during molding) and the overmolded cap still leaks.
The plastics we have tried are PP, PE, HIPS, ABS, PC, Nylon 12, PEEK, Ryton and LCP. Of these, only PEEK, Ryton and LCP held up to the autoclave environment and all have let in moisture and an associated, unacceptable shift.
Does anyone have any ideas on this? Has anyone else been able to seal out an autoclave process and how was that done?
Thanks,
Luke