ESPcomposites
Aerospace
- Jul 27, 2010
- 692
A post from another thread got me curious about elastic-plastic bonded joint analysis, such as those proposed by Hart-Smith.
I have used approaches like this in the research domain or space applications, but have yet to see them translated to the production aircraft side. I suppose as a qualitative study it could be useful, but are these models actually being used on production programs?
If using good design practice (i.e. proper taper ratios, correct joint type), would you really expect the bondline to fail if they have been properly processed? I might expect to see a bond failure due to processing problems, but the analysis cannot predict this. That scenario is the real issue in my eyes, which would make any analysis a theoretical upper limit of capability.
This is not to mention questions about adhesive properties, especially at temperature. In the end, testing and good design practice seems to be the way to go. This may then be combined with a failsafe approach which may assume a processing problem leading to a weak joint. I am not terribly confident in NDI either as poor bonds can go undetected. I have seen this happen on multiple occasions.
So I am wondering what the real world value of a high fidelity bonded joint analysis really is? Is it to just better understand the problem and make better decisions or is structure actually being certified to the analysis?
Brian
I have used approaches like this in the research domain or space applications, but have yet to see them translated to the production aircraft side. I suppose as a qualitative study it could be useful, but are these models actually being used on production programs?
If using good design practice (i.e. proper taper ratios, correct joint type), would you really expect the bondline to fail if they have been properly processed? I might expect to see a bond failure due to processing problems, but the analysis cannot predict this. That scenario is the real issue in my eyes, which would make any analysis a theoretical upper limit of capability.
This is not to mention questions about adhesive properties, especially at temperature. In the end, testing and good design practice seems to be the way to go. This may then be combined with a failsafe approach which may assume a processing problem leading to a weak joint. I am not terribly confident in NDI either as poor bonds can go undetected. I have seen this happen on multiple occasions.
So I am wondering what the real world value of a high fidelity bonded joint analysis really is? Is it to just better understand the problem and make better decisions or is structure actually being certified to the analysis?
Brian