QW 200.4 1

[pranam2911]

Dear All,

This is my first interaction with this forums,
1) I have a Combination PQR with base metal thickness 45mm (GTAW-5mm+SMAW-20mm+SAW-20mm), I just want to write a wps for smaw+saw from this pqr.So New Wps will be qualified for 5 to 200mm base metal thickness, and weld metal thickness range for SMAW(root) will be 0-200 (t>19mm) and SAW will be 0-200(t>19mm),Is my interpretation is right..?

2) QW-200.4(b)(Combination of welding process)

For GTAW, SMAW, GMAW, PAW, and SAW,
or combinations of these processes, a PQR for a process
recording a test coupon that was at least
1⁄2 in. (13 mm)
thick may be combined with one or more other PQRs
recording another welding process and any greater base
metal thickness. In this case, the process recorded on the
first PQR may be used to deposit the root layers using
the process(es) recorded on that PQR up to 2
t (for shortcircuiting
type of GMAW, see QW-404.32) in thickness
on base metal of the maximum thickness qualified by the
other PQR(s) used to support the WPS. The requirements
of Note (1) of tables QW-451.1 and QW-451.2 shall apply.[COLOR=][/color]

please interpret the above with some examples

 

[weldstan]

Yes. You may write your WPS for SMAW and SAW as you have stated,

 

[metengr]

One correction, the minimum thickness for the WPS for the weld deposit ranges is 5mm for the GTAW, SMAW and SAW processes, and not 0mm.

 

[pranam2911]

Thanks for your response,and what about QW-200.4(b)(Combination of welding process)

 

[metengr]

QW-200.4 concerns combining multiple PQR's with different processes. You have a multiple process single coupon and PQR.

 

[pranam2911]

thanks metengr,but i just want to know the interpretation of QW-200.4(b)(Combination of welding process) with some examples.

 

[metengr]

Look up some Section IX interpretations regarding QW-200.4. This would be best as examples.

 

[ChiangJaron]

Further concern, if the impact testing application in your case, the test specimens to be care about the position of made from.