francesco87
Aerospace
- Apr 4, 2011
- 9
Hi everybody,
I need to simulate - with a satisfactory accuracy - the attachment between a PCB (Printed Circuit Board) and some electronic modules through a pin-in-hole solder connection (see picture attached).
I found plenty of articles about the so-called Global-local modelling technique, in which a coarse global model is used to simulate the whole assembly; the output displacements are then given as inputs to a fine local model representing the critical region of interest. Nevertheless, this technique is usually adopted for a slightly different kind of attachment ("Ball-grid-array"), and I was wondering whether it is suitable for my case or not.
Any tips? Thanks in advance.
I need to simulate - with a satisfactory accuracy - the attachment between a PCB (Printed Circuit Board) and some electronic modules through a pin-in-hole solder connection (see picture attached).
I found plenty of articles about the so-called Global-local modelling technique, in which a coarse global model is used to simulate the whole assembly; the output displacements are then given as inputs to a fine local model representing the critical region of interest. Nevertheless, this technique is usually adopted for a slightly different kind of attachment ("Ball-grid-array"), and I was wondering whether it is suitable for my case or not.
Any tips? Thanks in advance.