rob46
Electrical
- Dec 23, 2004
- 49
Article "Bonding with signal reference grids" EC&M, December 1, 1999 has the following recommendations:
"The AC current on any portion of the SRG should not exceed 250mA. AC current exceeding this level will cause voltages that can affect data signals.
• Measure the equipment-grounding conductor on all AC branch circuits and/or equipment enclosures to verify impedance less than 0.1 ohm. (You should make this measurement with a ground impedance tester.)
• Take two-point bonding measurements between the SRG and all building grounding electrodes. The resistance measurements between any two points should be less than 0.1 ohm."
I looked through IEEE 1100, TIA 942 and other documents and was unable to find the source of the recommeded values. Please help me to locate the appropriate back-up documents.
"The AC current on any portion of the SRG should not exceed 250mA. AC current exceeding this level will cause voltages that can affect data signals.
• Measure the equipment-grounding conductor on all AC branch circuits and/or equipment enclosures to verify impedance less than 0.1 ohm. (You should make this measurement with a ground impedance tester.)
• Take two-point bonding measurements between the SRG and all building grounding electrodes. The resistance measurements between any two points should be less than 0.1 ohm."
I looked through IEEE 1100, TIA 942 and other documents and was unable to find the source of the recommeded values. Please help me to locate the appropriate back-up documents.