Can an analyis of a sealed electronics enclosure be modeled accurately in Pro/Mechanica Thermal?
I have some powered electronics on a board in a Sealed case. I would like to estimate the steady state Temperature of the Board. The cooling pathway is through the enclosed air surrounding the board. This enclosed air will heat the case. The case will then tranfer heat (convection) heat into the surrounding (free) air.
Can this be modeled or approximated in Pro/Mechanica?
Currently I'm trying to model the sealed air space as a conductive part of the model. I don't know how to do the convective heat transfer into the case (from the sealed space), can it be done?
I have some powered electronics on a board in a Sealed case. I would like to estimate the steady state Temperature of the Board. The cooling pathway is through the enclosed air surrounding the board. This enclosed air will heat the case. The case will then tranfer heat (convection) heat into the surrounding (free) air.
Can this be modeled or approximated in Pro/Mechanica?
Currently I'm trying to model the sealed air space as a conductive part of the model. I don't know how to do the convective heat transfer into the case (from the sealed space), can it be done?
