To refilwe,
I wouldn't mind to know what slo stands for.
Anyway, can you tell us what type of operation is involved, dry or wet ? Temperatures and pressures, what are they, and are they steady ? Do you have precondensers or is the tower directly connected to a main "booster" ejector ?
Generally, some of the options to recover more HVGO are:
[•] Unload the tower and the heater by improving
previous atmospheric GO removal.
[•] Reduce thermal cracking which affects vacuum.
[•] Reduce [Δ]P and flash zone pressure by
switching from pumparound trays to packing.
[•] Reduce number of wash trays; results as above.
[•] Improve vacuum generation.
[•] Increase the superheat of steam to the resid
stripping trays, and check the cooling effect of this
stripping; below 15 Celsius means the contact with steam
isn't OK. It may be due to tray flooding, corrosion, or
upset. Even a bottom level controller malfunction could
be the culprit.
[•] Don't over-wash the lower fractionation section.
[•] Seal weld HVGO and dark or slop VGO draw-off trays
to minimize leakage into the residue.
[•] Quench the bottoms to avoid thermal cracking.
[•] Circulate slop VGO to extinction.
The general ROT to verify whether there is too much HVGO (up to 540 Celsius) in the residue is to vacuum distill it in the lab. 5 to 10% is reasonably good; more than 30%, points to a poor performance. It even can markedly reduce the NPSHA of the bottom pump.
You may find some of the above steps aren't applicable or contradict each other.
Please comment.