Vibration of printed wiring boards (Circuit Card Assemblies) 1

[main9]

This covers the vibration of circuit card assemblies (printed wiring boards) located in electronic chassis. The boards are manufactuared using FR-4/Glass epoxy material.<br><br>I am looking for the following information.<br><br>1) material properties (modulus of elasticity, thermal conductivity, poisson's ratio) of FR-4 ?<br><br>2)any hand calculations that can be used to approximately calculate or quickly verify FEA analysis.<br><br>3)any technical paper/publications that provide the above information.<br><br>Need the information ASAP. Thank you.<br>

 

[tomirvine]

A good reference is:<br><br>Dave Steinberg, Vibration Analysis for Electronic Equipment, Wiley-Interscience, New York, 1988.<br><br>In addition, I have posted some related software and tutorials at:<br><br><A HREF="

http://www.vibrationdata.com"

TARGET="_new">

http://www.vibrationdata.com</A><br><br>Sincerely,

Tom Irvine