123131415
Mechanical
- Nov 13, 2006
- 16
Dear member,
I am designing process equipment enclosure for the following design condition
Annual cooling (DB/MCWB) – 91 F / 69.2 F and inside to be maintained at 1040F
Annual heating (DB) – (-17.7 F) and inside to be maintained at 50F
Evaporative colling (WB/MCDB) 73.5 F / 84.4 F and inside to be maintained at 104F
Return period 50 year, extreme annual condition (max/min DB) 107.6 F / -37.8 F and inside to be maintained at 33.8F.
cooling source-potable water
heating source – glycol solution
my problem is how to meet this design condition in HAP software V5.11
thank you
I am designing process equipment enclosure for the following design condition
Annual cooling (DB/MCWB) – 91 F / 69.2 F and inside to be maintained at 1040F
Annual heating (DB) – (-17.7 F) and inside to be maintained at 50F
Evaporative colling (WB/MCDB) 73.5 F / 84.4 F and inside to be maintained at 104F
Return period 50 year, extreme annual condition (max/min DB) 107.6 F / -37.8 F and inside to be maintained at 33.8F.
cooling source-potable water
heating source – glycol solution
my problem is how to meet this design condition in HAP software V5.11
thank you
