loudig
Mechanical
- Dec 27, 2007
- 18
I have two flexible circuit materials - Polyimide (PI), and Polyethylene Terephalate (PET). I need to bond a thin metal tab to flexible circuit pads on each of these substrates. I have 4 different methods of bonding:
1. Solder
2. Ultrasonic welding
3. Laser welding
4. ICF/ACF (Isotropic conductive film/Anisotropic conductive film). This method is used for bonding LCD displays to rigid and flexible circuits.
Does anyone have experience with these bonding methods and what is preferential? The PET has a melt point around 200-255 deg C so I already know that this will not work with soldering. In contrast PI has a melt temperature around 352-388 deg C.
-loudig
1. Solder
2. Ultrasonic welding
3. Laser welding
4. ICF/ACF (Isotropic conductive film/Anisotropic conductive film). This method is used for bonding LCD displays to rigid and flexible circuits.
Does anyone have experience with these bonding methods and what is preferential? The PET has a melt point around 200-255 deg C so I already know that this will not work with soldering. In contrast PI has a melt temperature around 352-388 deg C.
-loudig